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SPIE 2021 – Applied Materials – DRAM Scaling - SemiWiki
SPIE 2021 – Applied Materials – DRAM Scaling - SemiWiki

Amorphous Carbon Hard Mask for Multiple Patterning Lithography | Semantic Scholar
Amorphous Carbon Hard Mask for Multiple Patterning Lithography | Semantic Scholar

In situ” hard mask materials: a new methodology for creation of vertical silicon nanopillar and nanowire arrays - Nanoscale (RSC Publishing)
In situ” hard mask materials: a new methodology for creation of vertical silicon nanopillar and nanowire arrays - Nanoscale (RSC Publishing)

Conversion of a Patterned Organic Resist into a High Performance Inorganic Hard Mask for High Resolution Pattern Transfer | ACS Nano
Conversion of a Patterned Organic Resist into a High Performance Inorganic Hard Mask for High Resolution Pattern Transfer | ACS Nano

Spin-on Dual Hard Mask Material | JSR Micro, Inc.
Spin-on Dual Hard Mask Material | JSR Micro, Inc.

PDF] Chromium oxide as a hard mask material better than metallic chromium | Semantic Scholar
PDF] Chromium oxide as a hard mask material better than metallic chromium | Semantic Scholar

NIL_vs_NEP-768x604.png
NIL_vs_NEP-768x604.png

Development of a facile block copolymer method for creating hard mask patterns integrated into semiconductor manufacturing | SpringerLink
Development of a facile block copolymer method for creating hard mask patterns integrated into semiconductor manufacturing | SpringerLink

Progress in Spin-on Hard Mask Materials for Advanced Lithography | Semantic Scholar
Progress in Spin-on Hard Mask Materials for Advanced Lithography | Semantic Scholar

PDF) Impact of Sacrificial Hard Mask Material in BEOL Integration in Advanced Technology
PDF) Impact of Sacrificial Hard Mask Material in BEOL Integration in Advanced Technology

KR20160110657A - Polymer for hard mask, hard mask composition including the polymer, and method for forming pattern of semiconductor device using the hard mask composition - Google Patents
KR20160110657A - Polymer for hard mask, hard mask composition including the polymer, and method for forming pattern of semiconductor device using the hard mask composition - Google Patents

Spin-on Dual Hard Mask Material | JSR Micro, Inc.
Spin-on Dual Hard Mask Material | JSR Micro, Inc.

Precision micro-mechanical components in single crystal diamond by deep reactive ion etching | Microsystems & Nanoengineering
Precision micro-mechanical components in single crystal diamond by deep reactive ion etching | Microsystems & Nanoengineering

Etching with a hard mask - Plasma Etching - Texas Powerful Smart
Etching with a hard mask - Plasma Etching - Texas Powerful Smart

Progress in Spin-on Hard Mask Materials for Advanced Lithography | Semantic Scholar
Progress in Spin-on Hard Mask Materials for Advanced Lithography | Semantic Scholar

Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)
Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)

The micropatterns (first figure) can be achieved by | Chegg.com
The micropatterns (first figure) can be achieved by | Chegg.com

Spin on Hard-Mask Material - diagram, schematic, and image 08
Spin on Hard-Mask Material - diagram, schematic, and image 08

Microwaves101 | Photolithography 101
Microwaves101 | Photolithography 101

KR20160110657A - Polymer for hard mask, hard mask composition including the polymer, and method for forming pattern of semiconductor device using the hard mask composition - Google Patents
KR20160110657A - Polymer for hard mask, hard mask composition including the polymer, and method for forming pattern of semiconductor device using the hard mask composition - Google Patents

Etching characteristics of TiN used as hard mask in dielectric etch process: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena: Vol 24, No 5
Etching characteristics of TiN used as hard mask in dielectric etch process: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena: Vol 24, No 5

Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)
Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)

KR101484568B1 - High etch-resistant carbon hard mask condensasion polymer and anti-reflection hard mask composition including same, and pattern-forming method of semiconductor device using same - Google Patents
KR101484568B1 - High etch-resistant carbon hard mask condensasion polymer and anti-reflection hard mask composition including same, and pattern-forming method of semiconductor device using same - Google Patents

Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)
Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)

BALD Engineering - Born in Finland, Born to ALD: Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling
BALD Engineering - Born in Finland, Born to ALD: Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling

BALD Engineering - Born in Finland, Born to ALD: Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling
BALD Engineering - Born in Finland, Born to ALD: Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling

PDF) Sub-100 nm silicon-nitride hard-mask for high aspect-ratio silicon fins
PDF) Sub-100 nm silicon-nitride hard-mask for high aspect-ratio silicon fins

Innovatively composite hard mask to feature sub-30 nm gate patterning - ScienceDirect
Innovatively composite hard mask to feature sub-30 nm gate patterning - ScienceDirect